Apple Accelerates Development ntawm Nqis MR Headset nrog MicroOLED Innovations

Apple Accelerates Development ntawm Nqis MR Headset nrog MicroOLED Innovations

Raws li tsab ntawv ceeb toom los ntawm The Elec, Apple tab tom txhim kho kev txhim kho ntawm nws cov tiam tom ntej sib xyaw qhov tseeb (MR) lub mloog pob ntseg, siv cov kev daws teeb meem tshiab MicroOLED los txo cov nqi. Lub phiaj xwm tsom mus rau kev sib xyaw xim xim nrog cov iav-raws li Micro OLED substrates, aiming los tsim ib qho kev siv nyiaj-phooj ywg lwm txoj rau tus hwm Vision Pro headset.

Dual Technical Pathways rau kev sib xyaw xim lim

Apple's engineering team tab tom ntsuas ob txoj hauv kev tseem ceeb:

Kev xaiv A:Ib txheej iav Composite (W-OLED + CF)

• Siv cov iav substrate coated nrog dawb-lub teeb MicroOLED txheej

• Kev sib xyaw xim liab, ntsuab, thiab xiav (RGB) xim lim arrays ntawm qhov chaw

• Lub hom phiaj 1500 PPI daws teeb meem (vs. Vision Pro's silicon-raws li 3391 PPI)

Kev xaiv B:Dual-Layer iav Architecture

• Embeds Micro OLED lub teeb-emitting units ntawm cov iav qis

• Embeds xim lim matrices ntawm lub iav txheej sab saud

• Ua tiav optical coupling los ntawm precision lamination

Cov Kev Sib Tw Tseem Ceeb

Cov peev txheej qhia Apple qhov kev nyiam rau Thin-Film Encapsulation (TFE) txheej txheem los ncaj qha cov xim lim rau ntawm ib lub khob iav. Thaum txoj hauv kev no tuaj yeem txo cov cuab yeej tuab los ntawm 30%, nws ntsib cov teeb meem tseem ceeb:

1. Yuav tsum muaj qhov kub thiab txias (<120 ° C) los tiv thaiv cov khoom lim xim degradation

2. Xav tau micron-theem precision rau 1500 PPI lim (vs. 374 PPI hauv Samsung's Galaxy Z Fold6 sab hauv zaub)

Samsung's Color on Encapsulation (CoE) thev naus laus zis, siv nyob rau hauv cov khoom siv foldable, ua haujlwm raws li kev siv. Txawm li cas los xij, scaling qhov no rau MR headset specifications ho nce complexity.

Supply Chain Strategy & Cost Considerations

• Samsung zaub yog nyob rau hauv kev ua lag luam loj ntawm W-OLED + CF panels, leveraging nws cov kev txawj ntse COE.

• TFE mus kom ze, tab sis zoo rau slimness, yuav nce nqi ntau lawm los ntawm 15-20% vim yog high-density lim alignment.

Cov kws tshuaj ntsuam xyuas kev lag luam nco ntsoov tias Apple lub hom phiaj sib npaug ntawm cov nqi ua haujlwm nrog cov khoom zoo, tsim kom muaj qhov sib txawv ntawm MR khoom qib. Qhov kev tawm tswv yim no ua raws li nws lub hom phiaj los ua kom muaj kev daws teeb meem MR cov kev paub dhau los thaum tswj hwm kev tsim kho tshiab.